System Level Test (SLT)

This stage involves thorough electrical and functional testing of semiconductor chips, followed by yield analysis and product categorization based on test results.

Leveraging advanced automated testing and sorting systems, we support a wide range of chip package types and sizes, delivering exceptional flexibility and scalability.

This process not only enhances overall production efficiency but also ensures stable product quality, meeting the demanding standards for high-performance and high-reliability electronic components.

Lead Scan & Marking Inspection with Packaging - Tape & Reel / Tray / Tube

After chip testing and classification, the next critical stage is visual inspection and final packaging.

To ensure product quality and packaging integrity, the industry widely adopts an integrated process that combines lead scanning, visual inspection, and automated packaging into a high-efficiency, high-precision workflow.

This process begins with lead scan and marking/surface inspection performed by automated systems. Using Automated Optical Inspection (AOI), the system accurately detects issues such as bent, damaged, oxidized, or contaminated leads. It also verifies that IC markings such as model number, lot code, and brand—are clear, correctly positioned, and free of defects like ghosting or blurring.

Once inspection is complete, the product moves directly into the automated packaging line, where it is sorted into one of the following packaging types based on product characteristics and customer requirements:

• Tape & Reel: Ideal for SMD (Surface-Mount Devices), compatible with pick-and-place machines, enabling efficient SMT production.

• Tray: Suitable for larger or uniquely shaped ICs that require flat placement. Commonly used for high-end applications or retestable devices.

• Tube: Designed for traditional leaded components (e.g., DIP, SIP), compatible with manual or semi-automated insertion processes.

This fully automated end-to-end process, from inspection to packaging, minimizes human intervention, reduces the risk of contamination or damage, and enhances both yield and shipment consistency.

The implementation of this system reflects rigorous quality management and meets modern customer expectations for high quality, short lead times, and automation.

Marking / Ink Coating

At this stage, key product information such as part number, lot code, and brand logo—is printed on the IC surface. Common methods include laser engraving and ink printing.

This process not only supports product identification and traceability, but also plays a vital role in brand recognition and market distribution.

Through precise control and quality management across each process step, we ensure that every semiconductor product meets optimal condition before shipment fully aligned with the industry's high standards for performance and reliability.